I Elprint benytter vi vårt velkjente MIX-prinsipp, hvor standardoppbygginger av 1-, 2-, og 4-lags mønsterkort blir mixet med andre mønsterkort med de samme spesifikasjoner. Slik oppnås en bedre utnyttelse av produksjonspanelet og det er flere til å ”dele” på de faste kostnadene. Dette medfører at du som kunde får lavere priser på mønsterkort som kan mixes. Her på siden kan du se vår kapabilitet – både hva angår standard mønsterkort på mix og vår generelle kapabilitet for alle typer mønsterkort.
For at ditt mønsterkort skal kunne mixes må det oppfylle noen krav som er spesifisert i boksen umiddelbart under.
For flere tekniske opplysninger kan du med fordel lese nærmere om mønsterkort her på siden eller på www.macaos.com.
Hent en printervennlig PDF av våre kapabiliteter her (73.1 Kb)
Kapabilitet – MIX
| Production time | Minimum 2 days |
| Shipment time | 2 days |
| Base materials |
FR4 FR4 High TG |
| Product range |
1, 2 and 4 layer. 1.6 mm; 35 um copper in all layers. 4-layer have unspecified distance between layers. |
| Surface finish | Lead-free HASL |
| Solder mask |
Color: Green Bridge: 0.1 mm Over size (C): 0.1 mm |
| Component printing |
White Minimum 0.125 mm track width |
| Hole, minimum size (A) | 0.30 mm |
| Conductor width (D) | 0.125 mm |
| Conductor spacing (E) | 0.125 mm |
| Annular ring (B) | 0.15 mm |
| A | Finished hole size. Plated or non plated |
| B | Annular ring: (pad size – hole size) / 2 |
| C | Soldermask opening |
| D | Conductor width |
| E | Conductor spacing |
| F | Solder mask bridge |
| G | NPTH to copper |
Generel kapabilitet
| Standard | Special | |
| Production standard | IPC 6012C, Class 2 |
IPC 6012C, Class 3 Perfag Any special requirements |
| Production time | 5 days | 1-2 days |
| Shipment time | 2 days | 1 day. 3 days -3 weeks on series |
| Base materials |
FR4 FR4 High TG |
Rogers Aluminium core/carrier Polyimide (flex & rigid) Arlon |
| Product Range |
Single sided, double sided Multilayer Prototypes Small & large production series |
High density interconnect (HDI) Flex, Rigid-Flex Metal core/carrier (Alu) Impedance controlled PCBs |
| Board size |
Min 25×25, if smaller PCB must be panelized Max 500×600 mm |
Max 520-720 mm?? |
| PCB thickness | 1.6 mm standard, ± 10% |
FR4: 0.1 – 6.0 mm Min. inner layer: 0.05 mm |
| Copper thickness |
35µ Plating: 20µ for IPC Class 2 |
12-200µ Plating: 25µ for IPC Class 3 |
| Surface finish |
Lead free HASL ENIG (chem. NiAu) |
Silver Chemical Tin Hard Gold HASL (Non RoHS, with lead) |
| Mechanical processing |
Routing (2.4, 2.0, 1.6 mm) Routing tolerance: ±0.20 mm Scoring (PCB thicnkess: 0.8-2.4 mm) Scoring, min dist. Copper: 0.4 mm |
Min. routing tool: 0.6 mm dia. Routing tolerance: ±0.10 mm Plated edges Depth controlled routing Castellated holes (half moon holes) Blind & buried vias Peelable (blue) mask |
| Holes |
Mechanical: 0.25-6.2 mm Aspect ratio Through hole: 1:10 Aspect ratio blind hole: 1:1 Finished hole dia. tolerance: ± 0.1 mm. |
Mechnical: 0.10 mm Laser drill: 0.1 mm (0.07 mm possible) Aspect ratio Through hole: 1:20 Plugging: with solder mask, copper, non conductive paste. Overplate possible. |
| Solder mask |
Color: Green Bridge (F): 0.1 mm Over size (C): 0.1 mm Thickness, typical: 8-40µ |
Color: Red, white, black & blue Bridge (F): 0.07 mm Over size (C): 0.075 mm |
| Component printing |
Color: White Minimum line width: 0.125 mm |
Color: Yellow & Black Minimum line width: 0.1 mm |
| Data formats |
Macaos orders Gerber Extended, drill files ODB++ |
Basic Gerber pdf, doc, xls ect. |
|
Minimum distances: – Npt – copper – Outline – copper – Scoring – copper – Copper – copper |
See tables below 0.2 mm 0.4 mm See tables below |
See tables below 0.1 mm 0.3 mm See tables below |
Outer layer, copper thickness and line/space. Cheapest (Minimum)
| Starting copper thickness | Line width (D) | Line space (E) | NPTH – copper (G) |
| 18µ (43 plated)* | 150µ (100µ)** | 150µ (100µ)** | 200µ (150µ) |
| 35µ (70 plated) | 200µ (150µ) | 200µ (150µ) | 225µ (175µ) |
| 70µ (105 plated) | 300µ (250µ) | 300µ (250µ) | 250µ (200µ) |
| 105 (140 plated) | 400µ (300µ) | 400µ (350µ) | 300µ (250µ) |
| 140µ | 500µ (400µ) | 500µ (400µ) | 400µ (300µ) |
| 210µ | 600µ (500µ) | 600µ (500µ) | 500µ (400µ) |
| *) Commonly known as 35µ/1oz. | |||
| **) Down to 50µ width/space on 9µ base copper. |
Inner layer, copper thickness and line/space. Cheapest (Minimum)
| Starting copper thickness | Line width (D | Line space (E) | NPTH – copper (G) |
| 18µ | 125µ (75µ) | 125µ (75µ) | (300µ) |
| 35µ | 150µ (100µ) | 150µ (100µ) | (300µ) |
| 70µ | 250µ (200µ) | 250µ (200µ) | (300µ) |
| 105 | 300µ (250µ) | 300µ (250µ) | (300µ) |
| 140µ | 500µ (350µ) | 500µ (350µ) | (400µ) |
| 210µ | 600µ (500µ) | 600µ (500µ) | (500µ) |
Stenciler
| Maximum size | 595×595 mm |
| Thickness | 100, 120, 130, 150, 180, 200, 250µ |
| Treatment | Electro polished |
| Etching | Up to 2 thicknesses pr. stencil. Etch down in 10µ steps from base thickness. |
| Minimum opening size | 50µ |
| Minimum distance opening to opening | 150µ |