PCB
Kapabilitet
| Standard | Special | |
| Production standard | IPC 6012, performance class 2 | IPC 6012, performance class 3 Perfag Any special requirements |
| Production time | Min. 5 days | 1-2 days |
| Shipment time | 2 days | 1 day, 3 days – 3 weeks for series |
| Base materials | FR-4 (/21) FR-4 High-Tg (/129) | Rogers Aluminium core/carrier Polyimide (flex and rigid) ArlonCopper baseHalogen free FR4High CTI FR4Taconic Panasonic M6, M7 |
| Product range | Single sided Double sided Multi-layer [4-8 layers] Prototypes Small & large production series | High density interconnect (HDI) Multi-layer [10-64]Flex Rigid-flex Metal core/carrier Impedance controlled PCBs |
| Board size | Min 25 mm x 25 mm (if smaller, must be panelized) Max 500 mm x 600 mm | Max 620-1200 mm |
| Board thickness | 0.8-2.0 ±10% standard | 0.1 mm – 6.0 mm Min inner layer: 0.05 mm |
| Copper thickness | 35 µm Plating: 20 µm for IPC class 2 | 12 µm – 200 µm Plating: 25 µm for IPC class 3 |
| Surface finish | Lead-free HASL ENIG (Nickel/Gold) | Immersion Silver Immersion Tin Selective Hard GoldENEPIG (Nickel-palladium gold) HASL with Pb (non-RoHS – lead) |
| Mechanical processing | Routing (2.4, 2.0, 1.6 mm) tolerance ±0.20 mm Scoring (PCB thick 0.8-2.4 mm) min Cu clearance 0.4 mm | Min routing tool dia: 0.6 mm Routing tolerance ±0.10 mm Plated edges Depth controlled routing Castellated (half-moon) holes Blind/buried vias Peelable (blue) mask |
| Holes | Through hole aspect ratio: 1:10 Blind hole aspect ratio: 1:1 Finished dia tolerance: ±0.1 mm | Min mechanical dia: 0.10 mm Laser dia: 0.1 mm (min 0.7 mm) Through hole aspect ratio: 1:20 |
| Via protection | IPC-4761 type II (covered) IPC-4761 type III/IV (Plugged/and covered) IPC-4761 type V/VI (Filled/and covered) IPC-4761 type VII (Filled and capped) Filling material: Solder mask Copper Non-conductive paste Heat conductive resin | |
| Solder mask | Color: Green Min bridge (F): 0.1 mm Min oversize (C): 0.1 mm Thickness: Typical 8-40 µm | Color: Red, white, black, blue (other) Min bridge (F): 0.07 mm Min oversize (C): 0.075 mmGloss or matte finish as specified. |
| Component (legend) printing | Color: White Min line width: 0.125 mm | Color: Yellow, Black (other) Min line width: 0.1 mm |
| Min edge to Cu clearance | 0.2 mm | 0.1 mm |
| Min scoring to Cu clearance | 0.4 mm | 0.3 mm |
| Copper thickness (unplated/plated) |
Conductor width (D) | Conductor spacing (E) | NPT to Cu clearance (G) | ||||
| Cheapest | Minimum | Cheapest | Minimum | Cheapest | Minimum | ||
| Outer layers | 9/27 µm | 150 µm | 50 µm | 150 µm | 50 µm | 200 µm | 150 µm |
| 18/43 µm* | 150 µm | 50 µm | 150 µm | 50 µm | 200 µm | 150 µm | |
| 35/70 µm | 200 µm | 150 µm | 200 µm | 150 µm | 225 µm | 175 µm | |
| 70/105 µm | 300 µm | 250 µm | 300 µm | 250 µm | 250 µm | 200 µm | |
| 105/140 µm | 400 µm | 300 µm | 400 µm | 300 µm | 300 µm | 250 µm | |
| 140 µm | 500 µm | 400 µm | 500 µm | 400 µm | 400 µm | 300 µm | |
| 210 µm | 600 µm | 500 µm | 600 µm | 500 µm | 500 µm | 400 µm | |
| Inner layers |
18 µm | 125 µm | 50 µm | 125 µm | 50 µm | 300 µm | |
| 35 µm | 150 µm | 75 µm | 150 µm | 75 µm | 300 µm | ||
| 70 µm | 250 µm | 200 µm | 250 µm | 200 µm | 300 µm | ||
| 105 µm | 300 µm | 250 µm | 300 µm | 250 µm | 300 µm | ||
| 140 µm | 500 µm | 350 µm | 500 µm | 350 µm | 400 µm | ||
| 210 µm | 600 µm | 500 µm | 600 µm | 500 µm | 500 µm | ||
* Commonly referred to as 35µm/1oz
Flex PCB
Kapabilitet
| FLEX PCB | Capability |
| Max Layer Count Flex Board | 14L |
| Min Finished Board Thickness | 0.05mm |
| Max Board Size | 500mmx2000mm |
| Min Laser Drilled Hole Size | 0.05mm |
| Min Mechanical Drilled Hole Size | 0.1mm |
| Min Trace Width/Spacing | 0.04mm/0.04mm |
| Min Annular Ring of Single/Double-side Board | 0.075mm |
| Min Inner Layer Annular Ring of Multi-layer Board | 0.125mm |
| Min Outer Layer Annular Ring of Multi-layer Board | 0.1mm |
| Min Coverlay Bridge | 0.1mm |
| Min Soldermask Opening | 0.2mm |
| Min BGA Pitch | 0.5mm |
| Min Single-ended Impedance Tolerance | ±10% |
| Min Differential Impedance Tolerance | ±10% |
| Coverlay Registration | Manual Alignment 0.1mm, General Fixture 0.1mm, Precise Fixture 0.05mm |
| Material Type | Polymide, LCP, PET |
| Material Brand | Shengyi, ITEQ, Taiflex, Thinflex, Allstar, Panasonic, Dupont |
| Stiffener Type | FR4, PI, PET, Steel, Alumimum, PSA, Nylon |
| Surface Finish | ENIG, ENEPIG, OSP, Gold Plating, Gold Plating+ ENIG，Gold Plating+OSP, Immersion Silver, Immersion Tin, Plating Tin |
| Advanced Product | Flex+HDI (2+N+2) |
Flex Rigid PCB
Kapabilitet
| FLEX PCB | Capability |
| Max Layer Count Flex Board | 14L |
| Min Finished Board Thickness | 0.05mm |
| Max Board Size | 500mmx2000mm |
| Min Laser Drilled Hole Size | 0.05mm |
| Min Mechanical Drilled Hole Size | 0.1mm |
| Min Trace Width/Spacing | 0.04mm/0.04mm |
| Min Annular Ring of Single/Double-side Board | 0.075mm |
| Min Inner Layer Annular Ring of Multi-layer Board | 0.125mm |
| Min Outer Layer Annular Ring of Multi-layer Board | 0.1mm |
| Min Coverlay Bridge | 0.1mm |
| Min Soldermask Opening | 0.2mm |
| Min BGA Pitch | 0.5mm |
| Min Single-ended Impedance Tolerance | ±10% |
| Min Differential Impedance Tolerance | ±10% |
| Coverlay Registration | Manual Alignment 0.1mm, General Fixture 0.1mm, Precise Fixture 0.05mm |
| Material Type | Polymide, LCP, PET |
| Material Brand | Shengyi, ITEQ, Taiflex, Thinflex, Allstar, Panasonic, Dupont |
| Stiffener Type | FR4, PI, PET, Steel, Alumimum, PSA, Nylon |
| Surface Finish | ENIG, ENEPIG, OSP, Gold Plating, Gold Plating+ ENIG，Gold Plating+OSP, Immersion Silver, Immersion Tin, Plating Tin |
| Advanced Product | Flex+HDI (2+N+2) |