| Category | Default Selection | Optional Selection |
| Performance Class | Class 2 | Class 2+ |
| Material | Epoxy-Glass Laminate per 3.2.1 | |
| Surface finish | Finish X per Table 3-3 | |
| Minimum Starting Foil Weight | 1/2 oz. for all internal and external layers except Type 1 which shall start with 1 oz. For plated HDI layers – 1/4 oz. for all layers (internal or external) |
|
| Copper foil type | Electrodeposited per 3.2.4 | |
| Hole Diameter Tolerance Plated, components Plated, via only Non-plated |
( ±) 100 µm [3,937 µin] (+) 80 µm [3,150 µin], (-) no requirement, (may be totally or partially plugged) (±) 80 µm [3,150 µin] |
|
| Conductor Width tolerance | Class 2 requirements per 3.5.1 | |
| Conductor Spacing tolerance | Class 2 requirements per 3.5.2 | |
| Dielectric Separation | 90 µm [3,543 µin] minimum per 3.6.2.18 | |
| Lateral Conductor Spacing (Metal Cores) | 100 µm [3,937 µin] minimum per 3.6.2.17 | |
| Marking Ink | Contrasting color, nonconductive per 3.3.5 | |
| Solder Mask | Not applied, if not specified per 3.7 | |
| Solder Mask, specified | Class T of IPC-SM-840 if class not specified per 3.7 | |
| Solder Coating | Sn63/Pb37 per 3.2.7.3.1 | |
| Solderability Test | Per 3.3.6, Category 2 for SnPb and Category A for Pb-free of J-STD-003 | |
| Thermal Stress Test | IPC-TM-650, Method 2.6.8, Condition A per 3.6.1.1 | |
| Test Voltage, Isolation Resistance | Per IPC-9252 | |
| Qualification not specified | See IPC-6011 | |
| Hole Copper Plating | Hole copper plating shall meet class 3 requirements in the Surface and Hole Copper Plating table(s) of the appropriate IPC-6012 standard | |
| Minimum Annular Ring | Minimum annular ring shall meet class 3 requirements in the Minimum Annular Ring table(s) of the appropriate IPC-6012 standard | |
